The chip giant will launch advanced stacked chips over the next year - ensuring they change the face of the SSD market
Samsung has already started off Celebration of her three-dimensional memories Earlier this year with the launch of drives The V-NAND The first, and although we have not yet had the privilege of seeing a clear purposeful display of the great potential of this technology - already now there is no doubt that next year will be all about 3D In the world of storage.
Those who will join the trend during the year 2015 and power is none other than Chipzilla, who She announced That together with Micron will bring 3D 32 layer memories to the market that will deliver an unprecedented storage of 32GB on a chip basis NAND Single - This is based on the MLC technology, when using the TLC technology to store three bits in each cell will jump the storage volume in each chip Stacked to 48GB.
Intel believes that 2.5D chips will provide the ability to bring standard 10-inch 2.5-inch drives to market in the coming years (compare this to the largest mechanical drives currently available in 2-inch configuration - XNUMXTB and with significantly higher thickness and weight), and perhaps more importantly - Will allow to store terabytes of information in the medium storage Having a thickness of only 2 millimeters.
In addition to being able to compress much more information into a given physical size, 3D technology should also allow for more competitive prices on the one hand (less surface area, less chips, less wiring and all that implies), and better performance on the other hand Time and bandwidth are significantly better). So if you have not yet succeeded in convincing yourself to purchase a drive SSD - It is very possible that next year will be a very good time to make the big move.
Intel expects chip-NAND Its three-dimensional change will bring about a change in the market's agenda regarding price levels