The Z270 and H270 chips of the next generationKaby Lake Are exposed in a semi-official network
Waiting for Intel's new desktop processor generation and wanting to know what hardware components, motherboards, will be launched next to it? Specification is leaked from the trusted site Benchlife Pretending to reveal to us all the important technical details.
The two main chipsets in the new generation will be similar to what we saw in the current generation - the Z270 and H270 which will replace the Z170 and H170 respectively, all based on the latest LGA1151 bracket (with most motherboards based on the chipsets of the next generation -Skylake Should be supported by theKaby Lake Through dedicated firmware updates, although without some of the latest generation of technology additions).
The main news The new assessments will undoubtedly increase the amount of PCI-Express 3.0 arteries available for the peripheral hardware components that can connect to the system - 30 of them in total for both the Z270 and the H270, compared to 26 for the Z170 and 22 Only for the Skylake generation H170, 16 of which will be tuned for full-length PCI-Express 3.0 slots for graphics cards (greater bandwidth will only be possible when using dedicated bridge chips), four will be transferred to the DMI 3.0 artery for interface with chip The Northbridge and the rest for the addition of additional means via the motherboard.
This means the ability to connect more high-speed PCI Express 3.0 (or Thunderbolt 3) storage to the system, and this upgrade seems to support the support of the Kaby Lake generation In future Intel Optane products Which will be based on the 3D Xpoint architecture, which we have already seen as intended to be marketed as a real replacement for the X-SSD Advanced, but also as small and agile "system acceleration" drives at a more sane price.
With the exception of some small (but significant) changes, things seem to be the case: Z270 motherboards will be the only ones that will provide fast support for open-source processors and multi-card array applications using the SLI and CrossFire technologies, and the two new chipsets will offer the same number of SATA connections 3 (up to six) and the same number of USB connections 2.0 and USB 3.0 (up to 14 to 8 or 10 according to H270 and Z270) to the chipsets we currently know, along with support for up to four DRAM memory slots, dual interface Standard channels. Those who expected to see USB built-in support for 3.1 Gen 2 orThunderbolt 3, without the need for additional dedicated controllers, will be very disappointed.
The Kaby Lake generation appears to be a slight refresh for Intel's stationary platform even before the first model was formally launched, and the new information we received here does not really change that impression either. All we can do is hope that competition is on hand AMD Will lead to more interesting and worthwhile price levels, and that early reports about the next,Coffee Lake, They are accurate. Agree with us?