The new processor generation fromAMD The 7 nanometer will offer not only an improvement in efficiency and maximum performance of all Core And core - but also a unique and innovative arrangement for them that combines production technologies from different generations
Intel's decision to announce the arrival of 48 processors cores only one day before the Next Horizon event AMD Strengthened our assessment that we would be privileged to see something unusual in it - and it did happen, with a preliminary presentation of the new architecture that the cores of theZen 2.
We knew earlier that the next step of AMD, After launching the original Ryzen, Threadripper and EPYC products with cores Zen 14 nm lithography and updated products for the home market with cores Zen Plus in the production process of 12 nanometer, will be introducing a new generation with cores Zen 2 Improved in an innovative 7 nanometer manufacturing process during 2019 - and what we have just discovered is that the change will not only amount to cores, but will also be reflected in changing the overall internal architecture of the processors while emphasizing much lower downtime and keeping products simple and accessible.
The architecture of AMD For the first two Zen generations, Zeppelin chips consisting of eight processing cores were used in a pair of square CCX arrays that share an L3 cache and are connected by the fabric of Infinity Fabric connections for the ability to work together. This method significantly increased the potential output in the creation of massive processors with eight, sixteen and even 32 cores, but it also brought with it increased sensitivity to dynamic memory timings and frequencies that were connected to all chip Zeppelin is such a separate.
Despite the relative disadvantages, AMD Successfully closed most of the technological gap from Intel and even managed to overtake it with certain multi-core performance - but it seems that even the red chip developer came to the conclusion that there is a better way to create Processors With lots of cores, and its realization will begin in practice in the next generation.
In the era of Zen 2 base chips of AMD Chiplets will be prepared and will contain eight identical processing cores in a 7 nm production process from TSMC, with no subdivision into separate CCX units - and up to eight Chiplets will be connected together on the same substrate with a primary 14 I / O production process that will link them to memories God-DDR4 Based on Infinity Fabric interfaces, so that the balance between the chips and core that accompanied us on Zen and Zen Plus should disappear, with all units having equal access and up to eight memory channels with technical support for 4 terabytes of memory RAM.
The new arrangement will allowAMD Create ultra-tiny 7-nanometer chips and thus maximize their potential throughput, as well as save resources compared to a situation where both the memory controller and the Infinity Fabric connections were manufactured in the same advanced process. If that's not enough, the company believes that theZen 2 themselves will be able to offer a theoretical performance improvement of up to about 25 percent in the calculation of integers (INT) the same power consumption, plus a theoretical multiplication in floating point calculations (FP) thanks to support for new 256-bit commands designed for this.
With a new manufacturing process that probably jumps above the best transistor density that exists today at Intel, a solution seems to be the main bottleneck in previous generations, maintaining the modularity that allows maximum utilization of chips coming off the production line and increased performance and frequencies that will be moderate but important.AMD Is on the right track and with a particularly welcome momentum, and we are already looking forward to the commercial products that will allow us to dive into performance tests and learn the additions and capabilities under the metal cover.
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