Speed ​​from Another World: The Next Generation of Graphic Memories • HWzone
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Speed ​​from Another World: The Next Generation of Graphic Memories

JEDEC launches standardization for a new generation of Advanced - and Samsung plans to build on it with the potential for crazy 2TB bandwidth per second

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find HBM in products that are available to home consumers is not a simple task, and it seems not something that will change in the near future - the next generation of this device is already here, and it sounds exotic and expensive than ever.

The updated device for HBM2 now supports maximum speeds of up to 3.2 gigabits per second at the interface between the memory chips and the other system components, without changing the base interface from the 1,024 bit level that came with the second generation of technology - so for a single "tower" chip that will be integrated Together with Processing will be possible at speeds above 3TB, or 410GB per second.

While we await the announcement of a brand new HBM3 generation - God- Significantly upgrade and receive tens of percent increase in their speed of operation

These data become even more exciting as you begin to consider the possibility of integrating multiple HBM2 enclosures onto one interposer unit at the same time as the processing unit they will serve - with theoretical support for 12 layers of chips Fast one gigabyte of volume in any such package, the processing products of the future can come with up to 2GB of , At a fast speed, crazy rules of 1,640 gigabytes per second, or 1.64 terabytes per second. Most impressive, especially when you consider that the most advanced theoretical implementations of chips compete with technology Should be approaching the terabytes of bandwidth in "second" only.

JEDEC is the organization that sets the standard for The GDDR - and also for HBM, so that manufacturers can choose the best solution for each product and product

So when will we see the updated version of the HBM2 standard? It may be closer than you'd expect, as Samsung seems to be planning on relying on the technology in its HBM2E chips under the code name Flashbolt - with up to eight layers of 2GB each in the chassis Single for up to 16GB (and 64GB for four-array arrays) Such) in a recent production process of less than 20 nm, which was used for the Previous ones from the giant house.

Samsung is preparing for mass production of HBM Flashbolt this past quarter, announcing that it can offer these memories even faster than the JEDEC standard - up to 4.2 gigabits per second per pin on the interface, resulting in a monstrous theoretical speed of nearly 540 g. Gigabytes per second for a single chassis at the 1,024-bit interface, and 2.15 terabytes per second (!) For four in parallel.

Intends to be the first to take advantage of the generation The new - but we really hope to see competition in the field with other manufacturers who will embrace the capabilities

HBM2 technology can certainly knock any hardware fan out of the chair, but it seems that with the popularity of the cheaper and simpler GDDR6 technology to integrate - we will continue to find Flashbolt and the like in especially high-end products designed for the HPC worlds and information centers, within branded models The Tesla's And the Radeon Instinct of .


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