The Japanese company introduces a new standard for ultra-fast internal storage similar to cards microSD. Coming soon to all of us?
Toshiba has little affection for agile and tiny storage, as we already knew when it introduced tiny BGA drives for direct motherboard combat and the innovative BG4 drives that offered up to terabytes of volume at the M.2 interface with a length of only 30 millimeters (instead of 80 Millimeters on most drivesSSD In this essay). Now she wants to go all the way with a new standard for even smaller dimensions - get to know XFMExpress.
Quite a few laptop makers nowadays opt for drives SSD In a soldered BGA configuration, which may contribute to minimizing system dimensions and slightly reducing the risks of technical malfunctions in the product, but at the same time deprives consumers of the ability to replace and upgrade storage when needed. Any failure of the storage chip will require the replacement of the entire motherboard, as there is no practical way to separate the two.
XFMExpress is designed to provide the best compromise for this challenge - a new interface that can utilize a PCI-Express 3.0 × 4 artery similar to today's popular M.2 connectors (and a PCI-Express 4.0 × 4 artery in a next generation already in the planning) in favor of a tiny card in a reminiscent configuration The SD cards, with a dedicated holder from which it will be possible to remove it when needed and replace. The dimensions of the drives in BGA soldering, a solution for dissipating the heat generated (in the form of the metal bracket in which the card will be assembled) and the performance of the drives NVMe In a complete M.2 configuration - and all that is left is to hope that it will meet expectations and be gradually adopted by the various manufacturers in the field.
The dimensions of the XFMExpress card will be only 18 × 14 millimeters, with a thickness of 1.4 millimeters - compared to 11 × 15 millimeters and a thickness of 0.75 millimeters for microSD cards. Together with the dedicated bracket, the size of the XFMExpress will reach 22.2 × 17.5 millimeters with a thickness of 2.2 millimeters - which will be only a small chip SSD In a soldered BGA configuration that is usually available in an initial size of 20 × 16 millimeters with a thickness of up to 1.5 millimeters. The sacrifice is as small as possible for the future upgrade capability - certainly when the tiniest option available in the field today is M.2 drives in a 2230 configuration with dimensions of 22 × 30 millimeters (not including the bracket itself).
We still don't know when we will be able to see a practical commercial application of XFMExpress cards, if any, and whether there is a plan to sell cards storage Such to the general public or leave the product as a means for OEM and ODM manufacturers only - but promise to continue to follow and update you on all the details about this intriguing venture in the near future.