Not only Intel And Samsung in this race - for a partnership as well Toshiba And SanDisk has chip technology 3D Stacked of their own, which threatens to be more economical and advanced than anything we have heard about it until now
Shortly after Intel Micron announced (again) Their three-dimensional NAND chips, Which boasts no less than 32 layers of tiny and sophisticated silica structures, the competitor Toshiba-SanDisk With its own announcement on chipset BiCS technology (CPA Bit Cost Structure) - with no less than 48 layers that are "engraved" and built one on top of the other.
Toshiba and Micron's first-generation BiCS chips will offer 128 gigabytes per unit of volume, based on MLC technology that allows each cell in the chip to store two bits of information - in comparison To 256 Gigabit per chip based on the MLC method that Intel promises us, 128 Gigabit per MLC chip in the most advanced high-end chips that can be found on the market today (15 nm and 16 nm from Toshiba-SanDisk and Intel Micron respectively) and 128 Gigabit per MLC chip In the second generation of Samsung's V-NAND technology. Another detail to consider - Samsung's three-dimensional chipset has been in commercial production for almost a year, as have the planar chips, while the 3D chipset's Intel And Toshiba are in the process of producing limited samples only.
We do not yet know all the technical details behind BiCS technology (in fact, our knowledge is that it is based on a similar method of cargo isolation To Samsung's V-NAND technology, And in contrast to floating gates of Intel And micron), but a general rule of thumb in the 3-D chip world dictates that more layers are always better and more economical - so it seems unlikely that despite 128 gigabytes "only" for all chip, BiCS's chips Toshiba And SanDisk can offer very compact dimensions (with increased density and bit density), which will enable many of them to be compressed into products that will also be very competitive at the price level.
In any case, with commercial production scheduled only for the first half of next year - it is inevitable that we will see a few more technological changes and upgrades in both the BiCS and the competitors, until we have hands-on products that we can bring together and compare.
Are looking forward to the arrival of the 3-D chip revolution,SSD Modern and "flat" certainly satisfy you? Tell us what you think in the comments.