Toshiba and Western Digital leap forward: 3-D NAND chips with 64 layers on the way to mass production • HWzone
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Toshiba and Western Digital leap forward: 3-D NAND chips with 64 layers on the way to mass production

The third side in the race to the top of the world of flash chips really does not intend to be left behind

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Flash chip technology continues to surprise and astonish us every time.

It's not yet used to Lsiclolim as the drive 4 terabytes of Samsung for domestic consumers based on NAND chips 3D three-dimensional layers with 48, 60 or the drive terabytes of Seagate servers based on the world of three-dimensional chips Micron's most advanced You - And here comes a new and interesting announcement from another significant competitor in this area: Flash Forward, which is the collaboration between Toshiba and SanDisk, which today forms part of a company of course.

In the chip developer They revealed Chip technology Updated, nicknamed BiCS3 and boasts of being the first in the field with 64 layers of cells that store information in every structure - with support for both the MLC technique for storing two bits of information in each cell and the TLC technique for storing three bits of information in each cell.

A silky skyscraper with enormous potential
A silky skyscraper with enormous potential

The new chips will be characterized by a volume of 256 gigabytes (ie as 32 gigabytes) for each 3D structure, both in MLC and TLC, and similar in volume to each structure in BiCS2 - The previous technology of Toshiba and SanDisk, Characterized by an 48 layer structure. The new generation's significant upgrade comes as a clear reference to the intention of reaching 512 gigabytes per volume of such a 3D chip in the near future - with each package also consisting of several layers of chips To create a total volume of hundreds of gigabytes of information.

We first met BiCS technology last year
We first met BiCS technology last year

A fairly standard future combination for the 8 to 16 3 gigabytes of 512 gigabytes can give us a volume of 512 gigabytes, 768 gigabytes or even a whole terabyte in each enclosure and chassis to be embedded In the printed circuit of the volume - probably based on the TLC technique, which requires much less space than the MLC.

It looks standard and pretty boring on the outside, but may be quite revolutionary inside
It looks standard and pretty boring on the outside, but may be quite revolutionary inside

Mass production of BiCS3 technology chips is due in the first half of next year, and when that happens - we expect more tough competition than ever in the world of SSD drives in general and in the world of 3D chip drives in incredible compression and efficiency in particular: Samsung's Eternal Control from One Side, And Micron on the other side and of course the SanDisk WD- On the third track, there is no doubt that consumers can only profit from this intriguing situation.


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2 תגובות

  1. If any manufacturer today can give 30 TB
    Why not consider 4 or 6 GB a normal price for the private market?

    It's all a question of who will lower the price first and everyone after it will go down in price

    And the whole mechanical ardisk market has been erased from the world

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