Toshiba and Western Digital leap forward: 3-D NAND chips with 64 layers on the way to mass production

The third side in the race to the top of the world of flash chips really does not intend to be left behind

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Flash chip technology continues to surprise and astonish us every time.


It's not yet used to Lsiclolim as the drive 4 terabytes of Samsung for domestic consumers based on NAND chips 3D three-dimensional layers with 48, 60 or the drive terabytes of Seagate servers based on the world of three-dimensional chips Micron's most advanced You - And here comes her new and interesting announcing another significant competitor in this area: Flash Forward is a collaboration between Toshiba and SanDisk, which today is part of the notebook of course.

In the chip developer They revealed Chip technology And is proud to be the first in the field with 3 layers of cells that store information in each structure - with support for the MLC technique for storing two bits of information per cell, and TLC for storing three bits of information per cell.

A silky skyscraper with enormous potential
A silky skyscraper with enormous potential

The new chips will be characterized by the volume of 256 gigabytes (gigabytes 32) for each three-dimensional structure, both in MLC and in TLC, and like the volume of each structure in BiCS2 - The previous technology of Toshiba and SanDisk, Which was characterized by a structure of 48-layers. The significant upgrade of the new generation comes as part of a clear reference to the intention to reach the volumes of 512 gigabits per three-dimensional chip in the near future - as each package is also composed of several layers of chips To create a total volume of hundreds of gigabytes of information.

We first met BiCS technology last year
We first met BiCS technology last year

A fairly standard future integration for the 8 and 16 segments. The 3 Gigabit BiCS512 chip layers can give us 512 gigabytes, 768 gigabytes, or even an entire terabyte in every chassis and chassis. In the printed circuit of the volume - probably based on the TLC technique, which requires much less space than the MLC.

It looks standard and pretty boring on the outside, but may be quite revolutionary inside
It looks standard and pretty boring on the outside, but may be quite revolutionary inside

Mass production of BiCS3 chipsets is expected to come in the first half of next year, and when that happens, we will expect tougher competition than ever before. SSDs in general and worldwide 3D-based drives with outstanding density and efficiency in particular: Samsung, And Micron on the other side and of course the SanDisk WD- On the third track, there is no doubt that consumers can only profit from this intriguing situation.