A new standard for smartphones and tablets was officially introduced, with transfer speeds doubling the best we have seen in the field to date
Most of you probably still remember the days when memories in all smartphones were based on unidirectional eMMC channels, which made things like copying files from or to a computer and opening a gallery full of slow and tedious images. Fortunately, since then we have come to know the UFS standard, which broke into our lives three years ago with a much more modern and advanced bidirectional interface that enabled different banner products in our pocket to perform performance that was not far from the drives SSD On personal computers.
UFS memories in their latest 2.0 / 2.1 version are already a technological proposition without any real competitors in the smart device market, with continuous transfer speeds that can reach up to 800 or 900 megabytes per second and Performence Random files with small 4 files that reach the level of 20,000IOPS, but this does not prevent JEDEC, which is responsible for the development and development of the device, of thinking about the future that will go into the corner - and announce the UFS 3.0 standard, which promises to increase performance even more, To my drives NVMe And sophisticated household.
The StandardUFS 3.0 includes a new physical link layer and support for 11.6 Gigabit-per-second full-duplex transmission node per channel, or 23.2-Gb / s overall - translated into practical continuous transfer speeds of about 2.1 (~), After taking into account the 8b / 10b encoding method, which reduces the effective transmission of information by approximately 25.
UFS 3.0 also includes support for lower voltages that can reduce the total power consumption of storage chips, as well as memory support for 3D technology NAND In TLC structure - to larger volumes than in the past (terabyte of storage Inside the phone? We have already seen such products for the mobile market), a potentially lower price, and even improved random performance, even though this is not officially defined by the device itself.
The device will also add dedicated support to automotive market applications, with support for a much wider temperature range when needed, from minus 40 from 1 ° C to 1 ° C, and a dedicated working mode to extend the life and reliability of chips to a market where upgrades and replacements are not as frequent as ultra-Mobile Personal information.
The main question now is when we will be able to see the chips of the new device on our smartphones - and for the time being we still have no answer. So far we have not encountered any nose chip A new process that publicly announced support for UFS 3.0, although it is not entirely clear whether such support is available or that it was simply not disclosed prior to the release of the technical draft describing the standard itself. It is likely that the flagship devices that will accompany us in 2018 will provide the solution to the puzzle - or they will include the storage New generation, or its practical availability is something that appears somewhere in 2019.
In addition to the built-in UFS 3.0, JEDEC has announced an updated 1.1 standard for the UFS Card, designed to be fast and advanced removable memory devices with similar technology to compete in the world of microSD cards. We first heard about UFS Card two years ago thanks to Samsung, although we have never seen real support for technology in commercial products - but it is good to get a signal that the whole idea has not yet been shelved and gone but continues to develop slowly and hopes to find the right platform and opportunity to break out. We will definitely be happy to receive additional external storage cards that will be offered Performence Are higher than those that exist today, so we will keep our fingers on developments.