All you need to know about UFS 3.0 • HWzone

Everything you need to know about the UFS 3.0 standard

A new standard for smartphones and tablets was officially introduced, with transfer speeds doubling the best we have seen in the field to date

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Most of you probably still remember the days when memories in all smartphones were based on unidirectional eMMC channels, which made things like copying files from or to a computer and opening a gallery full of slow and tedious images. Fortunately, since then we have come to know the UFS standard, which broke into our lives three years ago with a much more modern and advanced bidirectional interface that enabled different banner products in our pocket to perform performance that was not far from the drives On personal computers.

UFS memories in their latest 2.0 / 2.1 version are already a technological proposition without any real competitors in the smart device market, with continuous transfer speeds that can reach up to 800 or 900 megabytes per second and Random with small 4 files that reach the level of about 20,000IOPS, but that doesn't stop JEDEC responsible for standardization and device development from thinking about the future going into a corner - and announcing the UFS 3.0 standard that promises to increase performance even more To drives And sophisticated household.

God- Returns, and is faster and more economical

The Standard 3.0 includes a new physical link layer and support for a Full-Duplex Full-Duplex Transmission Bandwidth of 11.6 gigabits per second per channel, or 23.2 gigabits per second overall - which translates to virtually continuous 2.1 gigabytes -Byte per second (!), After taking into account the 8b / 10b encoding method that reduces by about 25 percent effective transfer of information.

The power of full multiplexing, and some modern technologies

UFS 3.0 also includes support for lower voltages that can reduce the total power consumption of storage chips, as well as memory support for 3D technology In TLC structure - for larger volumes than before (terabytes of Inside the phone? We have already seen such products for the mobile market), a potentially lower price, and even improved random performance, even though this is not officially defined by the device itself.

Suitable for laptops and tablets, - And cars, too

The device will also add dedicated support to automotive market applications, with support for a much wider temperature range when needed, from minus 40 from 1 ° C to 1 ° C, and a dedicated working mode to extend the life and reliability of chips to a market where upgrades and replacements are not as frequent as ultra- Personal information.

The key question now is when can we see the new standard chips on our smartphones - and for that we have no answer yet. So far, we have not run into anyone A new rendering that publicly announced support for UFS 3.0, though it's unclear whether or not such support was unveiled before the technical draft describing the device itself was launched. The flagship devices that accompany us in 2018 are likely to provide the puzzle solution - or they will include the New generation, or its practical availability is something that appears somewhere in 2019.

Will we ever see cards Removable ultra-fast, not only in PR images? The updated device doesn't matter too much, but gives hope

In addition to the built-in UFS 3.0, JEDEC announced an updated 1.1 standard for UFS Card, designed to serve as fast and advanced removable memory devices with similar technology that will compete in the microSD card world. We first heard about UFS Card two years ago thanks to Samsung, though we have never seen real technology support for commercial products - but it is good to get a signal that the whole idea has not yet been shelved and gone, but continues to evolve slowly and hopes to find the right stage and opportunity to break through. We would certainly love to have more external storage cards offered Are higher than those that exist today, so we will keep our fingers on developments.

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