The new octagonal Dimensity 900 model is designed to continue the significant success its brother experienced in the midmarket last year - with reinforcement from an upgraded manufacturing process by 6 nanometers
There is not a huge amount of Dimensity devices sold in Israel, but those that are here prove in most cases that Mediatek is able to provide technologies and better performance than those of the rival Qualcomm (Qualcomm) for the same price levels - and soon we may see more of them thanks to the new model that claims to bring even more performance and efficiency at the mid-price.
The new Dimensity 900 chip is based on TSMC's 6 nanometer manufacturing process, with a 15 percent improvement in transistor density over the company's 7 nanometer manufacturing processes that theoretically allow for the same capabilities in smaller (and cheaper) pieces of silicone or alternatively Add more units to a given piece of silicone - and what you will find in this model is a pair of modern Cortex-A78 cores of ARM At 2.4GHz, plus 6 cost-effective and well-known 55 Cortex-A2 cores with speeds of up to 68GHz and a graphical core in a more modern Mali-G4MCXNUMX architecture.
This is the first commercial use of the graphic core of ARM The Mali-G68, though the internal processing units are similar to those found in the company's top Mali-G78 cores (which star in the latest Huawei and Samsung chips), with a match in the number of processing clusters and cache volumes for the mid-market - so That despite the fact that this is a somewhat modest number of Processors Active, their efficiency and support for display technologies should be significantly better than what we saw in the Dimensity 800 and Dimensity 700 models earlier.
The Dimensity 900 chips include support for elongated FullHD Plus screens, with refresh rates of up to 120 Hz of course, fast internal storage in the UFS 2.1 or UFS 3.1 standard and also dynamic memories of the LPDDR5 or LPDDR4X type, in addition to the modem 5G Built-in with parallel work support for a pair of SIM cards at theoretical download speeds of up to 2.77 Gbps.
The chips will benefit from the unit עיבוד תמונה Suitable for sensors up to 108 megapixels, processing engine for accelerating computational learning and artificial intelligence, support for dual-channel GNSS receivers for improved accuracy, support for Bluetooth 5.2 wireless connectivity and support for connectivity Wi-Fi 6 (or Wi-Fi 802.11ax) Dual channels.
First smart devices with Dimensity 900 chips inside are slated to be unveiled before the end of next month, meaning before the end of the second quarter of 2021 - and first appearances in the popular performance test database Antutu indicate an improvement of more than 10 percent compared to devices with Dimensity 820 chips. Compared to devices with Snapdragon 768G chipsets Qualcomm (And also more than devices with the chipsSnapdragon 765G more common). Assuming that this data will also be preserved in the final versions of the product, it seems that it will be in second place in the entire intermediate market for the current year - a little behind the models.Snapdragon The fresh 780G.
Who do you think will be the first manufacturer to embrace this development? Feel free to talk about it now in the comments.