Using the new 3-D BiCS technology enables volumetric gain storage Up to 256 GB, with continuous transfer speeds up to 900 MB per second - inside the device in your pocket
Parallel to the promising declaration on the part of סמסונג, Also a company Toshiba And its competitor SanDisk (Through the Western Digital landlady) come out with their own exposures to products UFS 2.1 A new generation for tomorrow's smartphones.
Building on a three-dimensional structure from the latest BiCS technology section, with 64 layers and TLC configuration to store three bits of information per cell, which we've already seen in products SSD To the computer market, enabling the creation of chips storage 32 gigabytes, 64 gigabytes, 128 gigabytes and even 256 gigabytes, which will be commercially available to all smartphone and tablet manufacturers during the first half of 2018.
The volumes themselves may be those that are already available on the market today and do not bring in an extreme line, but promise continuous performance of up to 900 megabytes in reading and up to 180 megabytes in writing, along with random performance that reaches several tens of thousands of I / O operations per second and improves up to 2 chips UFS Of the previous generation that have been built on 48's BiCS structures, makes the new chips more interesting and effective.
There is no doubt that the "UFS It is the future of the mobile world, but limited availability of chips based on it has limited the extent of migration from the aging eMMC facility over the past two years - and now we hope that the announcement of new chips from the largest and most significant players in the entire market calls for challenges and gaps narrowed. The agile and sophisticated storage not only in prominent flagship products, but also in a variety of intermediate products and perhaps even in various discounted models.