Using the new 3-D BiCS technology enables volumetric gain storage Up to 256 gigabytes, with continuous transfer speeds reaching 900 megabytes per second - inside the device in your pocket
Parallel to the promising declaration on the part of סמסונג, Also a company Toshiba And its competitor SanDisk (Through the Western Digital landlady) come out with their own exposures to products UFS 2.1 A new generation for tomorrow's smartphones.
Building on a three-dimensional structure from the latest BiCS technology section, with 64 layers and TLC configuration to store three bits of information per cell, which we've already seen in products SSD To the computer market, enabling the creation of chips storage 32 gigabytes, 64 gigabytes, 128 gigabytes and even 256 gigabytes, which will be commercially available to all smartphone and tablet manufacturers during the first half of 2018.
The volumes themselves are perhaps already available in the market today and do not bring extreme news, but promise continuous performance of up to 900 megabytes in reading and up to 180 megabytes in writing, along with Performence Which come to several tens of thousands of I / O operations per second and constitute an improvement of up to 2 times from chips UFS Of the previous generation that have been built on 48's BiCS structures, makes the new chips more interesting and effective.
There is no doubt that the "UFS It is the future of the mobile world, but the limited availability of chips based on it has limited the scope of the aging eMMC facility over the past two years - and now we hope to announce new chips from the biggest and most significant players in the entire market that the challenges have been addressed and the gaps narrowed, and we will soon be able to accept The agile and elaborate storage not only in prominent flag products, but also in a variety of intermediate products and perhaps even in various discounted models.