A new standard for smartphones and tablets was officially introduced, with transfer speeds doubling the best we have seen in the field to date
Most of you probably still remember the days when memories in all smartphones were based on unidirectional eMMC channels, which made things like copying files from or to a computer and opening a gallery full of slow and tedious images. Fortunately, since then we have come to know the UFS standard, which broke into our lives three years ago with a much more modern and advanced bidirectional interface that enabled different banner products in our pocket to perform performance that was not far from the drives SSD On personal computers.
The latest UFS memories in their latest version 2.0 / 2.1 are already a technological offering with no real competition in the smart device market, with continuous transfer speeds that can reach up to 800 or 900 megabytes per second and also random performance with small 4 kilobytes that reach the level of About 20,000 IOPS, but that does not stop JEDEC, which is responsible for standardizing and developing the standard, from thinking about the future that will be around the corner - and announcing the UFS 3.0 standard that promises to increase performance even more, to a level more similar to drives NVMe And sophisticated household.
The StandardUFS 3.0 Includes a new physical link layer and support for a pair of Full-Duplex transmission arteries with a bandwidth of 11.6 GB per second per channel, or 23.2 GB per second in total - which translates into practical continuous transfer speeds of about 2.1 GB -Byte per second (!), After taking into account the 8b / 10b coding method which reduces the effective information transfer by about 25 percent.
UFS 3.0 also includes support for lower voltages that can reduce the total power consumption of storage chips, as well as memory support for 3D technology NAND In TLC structure - for larger volumes than before (terabytes of storage Inside the phone? We have already seen such products for the mobile market), a potentially lower price, and even improved random performance, even though this is not officially defined by the device itself.
The device will also add dedicated support to automotive market applications, with support for a much wider temperature range when needed, from minus 40 from 1 ° C to 1 ° C, and a dedicated working mode to extend the life and reliability of chips to a market where upgrades and replacements are not as frequent as ultra-Mobile Personal information.
The main question now is when we will be able to see the new standard chips in our smartphones - and for that we have no answer yet. So far we have not encountered any chip A new processing that has publicly announced support for UFS 3.0, though it is not really clear whether there is any such support or it was simply not revealed prior to the launch of the technical draft describing the device itself. It is likely that the flagship devices that will accompany us in 2018 will provide the solution to the riddle - or they will include the storage New generation, or its practical availability is something that appears somewhere in 2019.
In addition to the built-in UFS 3.0, JEDEC has announced an updated 1.1 standard for the UFS Card, which is designed to be used as fast and advanced removable memory devices in similar technology that will compete in the world of microSD cards. We first heard about UFS Card two years ago thanks to Samsung, although we have never seen real support for technology in commercial products - but it is good to receive a signal that the whole idea has not yet been shelved and gone, but continues to evolve slowly and hope to find the right stage and opportunity. We will definitely be happy to get more tickets storage Exteriors that will offer higher performance than those that exist today, so we will continue to keep our fingers crossed for developments.