We all expected to hear news about chip God-Snapdragon 875 - But Qualcomm decided to surprise with a more prominent and interesting name, which emphasizes the juicy technological leap that awaits inside
December has arrived, and with it the announcement of Qualcomm's chip Which will proudly lead a new generation of expensive and prestigious devices with the start of next year - theSnapdragon 888, which we knew through previous leaks as theSnapdragon 875 before the American chip developer decided to surprise and bring us a little closer to the end date for the current branding method.
The number that accompanies the name Snapdragon It is nothing more than a curiosity - but the improvements that the company promises us at the forefront of the Android market for 2021 are such that they can not be underestimated. God-Snapdragon 888 will maintain a 1 + 3 + 4 core design, this time the senior core will not only offer the highest operating frequency but will also be based on a different and more advanced Cortex-X1 architecture than the rest, with one megabyte of L2 cache memory reserved only It has the ability to reach up to 2.84 GHz when it is at its peak. Three additional cores will be based on enhanced Cortex-A78 architecture with a frequency of up to 2.42GHz and dual cache memory from L2 level of 512 KB compared to the Cortex-A77 cores inSnapdragon 865 - while the four cost-effective Cortex-A55 cores remain virtually unchanged, with 128 KB of memory L2 level cache for each and maximum operating frequency of up to 1.8GHz.

Qualcomm guarantees a 25 percent improvement in maximum performance for a single core and multi-core compared toSnapdragon 865, and an even greater improvement of up to 35 percent in graphics processing with its new Adreno 660 core plus a 20 percent improvement in operating efficiency along with the current generation - with support for new processing modes that increase computational learning performance by 40 percent and also important support In the important VRS (Variable Rate Shading) technology that can significantly improve the visual quality in works that will be used correctly and wisely.

The new chip is manufactured in a new 5-nanometer process from Samsung, 5LPE, which is a comeback in the collaboration between the two companies after two generations of flagship products that are based on 7-nanometer manufacturing processes at the competitor across the TSMC road. It is difficult to estimate the potential performance gaps between this process and the 5nm competitor process of TSMC that serves as the basis for theApple Both the A14 and the Kirin 9000, but the choice of Samsung may allow Qualcomm to enjoy queue previews and get a larger-scale chip supply that will allow the launch of more models in shorter periods of time relative to production lines inTSMC For them the competition is particularly tough on the part of a large part of the biggest names in the business.

The new chip includes a triangular image processing array with support for sensors with a resolution of up to 200 megapixels (a hint of what Sony and Samsung are preparing for us in the field soon, probably) and the ability to operate three sensors with resolutions of up to 28 megapixels simultaneously to create more advanced and unique computer processing. (From information that flows from a wide-angle sensor, a telephoto sensor and a standard sensor at the same time, for example), a square channel LPDDR5 memory controller with a default speed of 3,200MHz that can provide increased bandwidth by more than 50 percent compared toSnapdragon 865 that also provided backward support for more basic LPDDR4X memories, an up-to-date Hexagon 780 digital processing engine that along with improved graphics core is capable of delivering high-performance computations at 73 percentSnapdragon 865 - and also supports cellular modem 5G Returns to be an integral part of the CPU chip, with support for theoretical integrated download speeds of up to 7,500 megabits per second on fifth-generation networks.

First smartphones that include the Snapdragon 888 may start flowing to stores around the world as early as next month, and we can only hope that alongside the guaranteed performance improvements, the re-assimilation of the modem within chip The main processing and the transition to an innovative manufacturing process will help us enjoy particularly impressive efficiency (and battery life) and perhaps even slightly more affordable prices.