The upcoming Snapdragon 845 should be the first swallow in the new partnership between Qualcomm and the chipmaker TSMC - which will turn competition against סמסונג More intriguing
After Samsung announced the Beginning mass production of their next leading chipIt is natural that reports of rumors and rumors about his main direct competitor - the successor of chip The popular Snapdragon 835 Qualcomm, Who according to all signs will receive the name Snapdragon 845 and will constitute a fundamental change in some of the most important parameters.
A recent report purports to offer us a snapshot of the chip that may be partially exposed early next month at the CES Grand Show in Las Vegas (just like its predecessor this year), and declares that in the current generation the Kryo 3XX core processing core will appear on the latest cores Of the company ARM Itself, the Cortex A75. These four cores will run at up to 2.5GHz atSnapdragon 845, along with four more cost-effective Cortex A53 cores that will operate at lower frequency and provide solutions for situations where minimum capacities and maximum efficiency are required.
An updated version of the new generation Adreno 630 comes with a new digital microprocessor that supports up to four different sensors and a maximum 25 resolution for a single sensor and an X20 built-in cellular modem that can reach 1.2 maximum theoretical download speeds Gigabits per second, just like what is described for the Exynos 9810 סמסונג.
The most intriguing detail about the Snapdragon 845 is that, according to reports we have already received in the past, the product will be the first fruit of the renewal of cooperation between Qualcomm and the major Taiwanese chipmaker TSMC, after its collaboration with Samsung and its first 10 nanometer generation Snapdragon 835. If that information is true, we would expect an interesting head-to-head comparison of the performance and efficiency of the first TSNC 10 generation with the Samsung 10 second generation generation, on which the Exynos 9810 will be based - this after chips such as theApple The Bionic A11 and the Kirin 970 have already shown us that the lithography of the TSMC Had the potential to compress more transistors in a given area than the competitor's.
Whether this advantage will be translated into transportation in the processing capabilities, or the new 10LPP of סמסונג Will give it the crown of technological leadership? This will undoubtedly be one of the most juicy questions for hardware enthusiasts over the next few months.