The upcoming Snapdragon 845 should be the first swallow in the new partnership between Qualcomm and TSMC, which will turn the competition against סמסונג More intriguing
After Samsung announced the Beginning mass production of their next leading chip, It seems natural that the reports and rumors seem to have increased over his main direct competitor - the heir to chip The popular Snapdragon 835 Qualcomm, Who according to all signs will receive the name Snapdragon 845 and will constitute a fundamental change in some of the most important parameters.
A recent report purports to offer us a snapshot of the chip that may be partially exposed early next month at the CES Grand Show in Las Vegas (just like its predecessor this year), and declares that in the current generation the Kryo 3XX core processing core will appear on the latest cores Of the company ARM Itself, the Cortex A75. These four cores will run at up to 2.5GHz atSnapdragon 845, along with four more cost-effective Cortex A53 cores that will operate at lower frequency and provide solutions for situations where minimum capacities and maximum efficiency are required.
An updated version of the new generation Adreno 630 comes with a new digital microprocessor that supports up to four different sensors and a maximum 25 resolution for a single sensor and an X20 built-in cellular modem that can reach 1.2 maximum theoretical download speeds Gigabits per second, just like what is described for the Exynos 9810 סמסונג.
The most intriguing detail about the Snapdragon 845 is that, according to reports we have already received, it will be the first fruit of the renewed cooperation between Qualcomm and the large Taiwan chip manufacturer TSMC after the collaboration with Samsung and its first 10 nanometer in Snapdragon 835. If this information is true, we will have an interesting head-to-head comparison of the performance and efficiency of TSMC's first 10 nanometer generation against Samsung's second 10 nanometer, on which the Exynos 9810 will be based -Apple The Bionic A11 and the Kirin 970 have already shown us that the lithography of the TSMC Had the potential to compress more transistors in a given area than the competitor's.
Whether this advantage will be translated into transportation in the processing capabilities, or the new 10LPP of סמסונג Will give it the crown of technological leadership? This will undoubtedly be one of the most juicy questions for hardware enthusiasts over the next few months.