The struggling Japanese manufacturer continues to push its business in the world of flash chips with all its might, and announces an innovative 3D production technology that can give Fite to all competitors
We continue to hear many different estimates that the only direction that can be predicted for the price of flash chips is upwards, and our single potential to continue enjoying fast-based storage products NAND At cheaper prices, is through new-generation 3-D chipsets, which will be able to compress more and more units to store bits of data in volume chip Silicon, and will directly affect the relative price per volume storage Wherever he is.
A chip maker that is pushing chip density to new heights more than anything else סמסונגAlthough unsurprisingly, it is not surprising that the benefits we see at the end of the day are minimal, at least as far as prices are concerned - and that may change in the coming months, at last, with the launch of a new era of technology announced by Toshiba, in collaboration with the partner Her longtime SanDisk-Western Digital.
In Toshiba, examples of three-dimensional BiCS (chip Bit Cost Scalable) architecture chips were started, with an 64 layered structure and a TLC configuration where three bits of information are stored in each storage cell - with an incredible total volume of 512 gigabytes (or 64 gigabyte) in every chip, which is something only Samsung has managed to get ahead of, with the announcement coming at the end of 2016 as part of a new generation of V-technologyNAND Its rival 3D.
Here, the revolutionary part is not over because 16, such innovative storage chips, can be stacked and combined into a package chip Lonely - and so get a tiny, agile unit with an incredible volume of terabytes!
This new generation of chips will open up a variety of interesting storage options with the potential to receive tiny tablets and mobile phones with an entire soldered up to full terabyte of storage capacity, as well as standard-length M.2 drives capable of providing 3 terabytes of single-sided printed circuit storage Or up to 6 terabytes of storage (!!) in a double-sided printed circuit - and drives SSD In the 2.5, the map can theoretically reach 10 terabytes and even 12 terabytes, in dimensions where we have become accustomed to receiving one or two terabytes so far.
Mass commercial production of new generation chips is scheduled to begin in the middle of this year, so that the first real products that will be based on them may emerge during the third quarter of the year, SSD "Ready" and then only on smartphones and whole computers - and although it's clear that all this business won't be cheap at first, this move should bring us closer to more competitive prices for drives SSD Now that there will be at least two manufacturers in the market who know how to supply 512 3-gigabit chips to various customers, thereby increasing overall supply and also the willingness to fight for market share.
In a matter of time, will terabytes really become the basic storage unit that we know in the hardware world? We can only hope to hold on to it.